Promex Industries, a provider of advanced design, packaging, and microelectronic assembly services, recently announced it has completed the first phase of its plan to expand its die bonding services. The company has installed a new 2200 evo ^plus die bonder from BE Semiconductor Industries on its production line, which will add significant capacity, enhanced accuracy, productivity, and flexibility for customer projects in a range of markets. Additionally, another key feature of the evo ^plus is its optional heated bond head and stage, contributing to its ability to accommodate a variety of substrates and materials. The substrates and materials that can be accommodated include die attach film, which has become essential in the heterogeneous integration era for use in wafer prep and singulation of wire-bonded single and multi-chip stacked die solutions.