Interconnect Technology Enhances Cable Assembly Performance

March 1, 2006

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Interconnect Technology Enhances Cable Assembly Performance


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Interconnect Technology Enhances Cable Assembly Performance

Shana Leonard

cm.jpgA manufacturer of cables and assemblies has introduced a wire welding and soldering operation aimed at facilitating high data-transmission speeds and mechanical strength in cable assemblies. Direct Attach technology by C&M Corp. (Wauregan, CT) is suited for high speed, high-performance computing applications, test equipment, and automation communications.

The firm's interconnect method centers around the welding or soldering of signal wires directly to the connector contact. "It's a welded joint, so what you get is a molecular transfer of material from the wire to the connector," says Hal Mueller, director of sales and marketing for C&M. "It's the difference between gluing two things and having them dissolve together."

Fusing the two components together renders printed circuit boards (PCBs) unnecessary, according to the company. Noise and impedance often associated with PCBs can cause delays in signals at higher data rates, a hazardous chance to take in the medical industry, Mueller says.

However, the company recognizes that some customers may want or require a PCB. In this case, the company claims that Direct Attach creates a better termination than traditional soldering. Furthermore, the impedance-diminishing advantages of the technology will be applied to the assembly, despite the presence of a PCB, according to Mueller.

The strong connection and automated indexing ensure repeatability and consistency, according to the firm.

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