Low-Pressure Sensing Die Minimizes Position Sensitivity

A sensor die has been developed for high-volume applications that require pressure measurement to as low as 0.25 in. in water, full scale. The design of the MEMS piezoresistive low-pressure sensing die features maximum pressure response while maintaining low package stress susceptibility. Utilizing an open-bridge configuration, the die measures 2 × 2 mm2. A bossless structure minimizes position sensitivity.

All Sensors Corp.
Morgan Hill, CA, 408/225-4314