Tabletop hot-bar reflow soldering systems can perform anisotropic conductive–film bonding, reflow soldering, heat-staking heat-seal bonding, and hot-bar bonding. The pneumatic bonding heads of the Desktop Bonder series feature proprietary pulsed-heat thermode technology. This accelerates heating and cooling cycles, minimizing the length of processing cycles.

September 14, 2011

1 Min Read
Company Develops Tabletop Soldering Systems

Miyachi Unitek has developed tabletop hot-bar reflow soldering systems.Tabletop hot-bar reflow soldering systems can perform anisotropic conductive–film bonding, reflow soldering, heat-staking heat-seal bonding, and hot-bar bonding. The pneumatic bonding heads of the Desktop Bonder series feature proprietary pulsed-heat thermode technology. This accelerates heating and cooling cycles, minimizing the length of processing cycles. The thermode maintains coplanarity and resists deformation.

Miyachi Unitek Corp.
Monrovia, CA, 626/303-5676
 

Sign up for the QMED & MD+DI Daily newsletter.

You May Also Like