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Company Develops Tabletop Soldering Systems
Tabletop hot-bar reflow soldering systems can perform anisotropic conductive–film bonding, reflow soldering, heat-staking heat-seal bonding, and hot-bar bonding. The pneumatic bonding heads of the Desktop Bonder series feature proprietary pulsed-heat thermode technology. This accelerates heating and cooling cycles, minimizing the length of processing cycles.
September 14, 2011
1 Min Read
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Tabletop hot-bar reflow soldering systems can perform anisotropic conductive–film bonding, reflow soldering, heat-staking heat-seal bonding, and hot-bar bonding. The pneumatic bonding heads of the Desktop Bonder series feature proprietary pulsed-heat thermode technology. This accelerates heating and cooling cycles, minimizing the length of processing cycles. The thermode maintains coplanarity and resists deformation.
Miyachi Unitek Corp.
Monrovia, CA, 626/303-5676
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