Conductive Plastics for Medical Applications
January 1, 1999
Medical Device & Diagnostic Industry Magazine
MDDI Article Index
An MD&DI January 1999 Column
SPECIAL SECTION
Polymer materials compounded with a variety of additives provide design flexibility in protecting against static accumulation, ESD, and EMI/RFI.
The rapid growth of thermoplastics in medical markets is a testament to the suitability of these materials to meet the demands of today's healthcare industry. Thermoplastics can be compounded with a variety of common and specialty fillers, reinforcements, and modifiers to yield specific properties in a wide range of applications.
Among these additives are electrically conductive modifiers that, when compounded with thermoplastics, can provide protection against static accumulation, electrostatic discharge (ESD), and electromagnetic and radio-frequency interference (EMI/RFI). Although conductive thermoplastics are traditionally found in electronic, business-machine, computer, and industrial applications, the medical community is realizing enhanced performance and value in using these specialty materials for everything from tools to trays.
STATIC AND EMI/RFI
The effects caused by static and EMI/RFI are as familiar as sparks jumping from fingertip to doorknob, static cling in fabrics and films, and electronic noise in communications networks. Static accumulation and discharge and EMI/RFI can be either man-made or naturally occurring phenomena and may not necessarily pose a problem.
However, when present in, on, or near electronic circuitry, moving materials, or flammable environments, they create hazards that must be controlled or eliminated. ESD can damage or destroy sensitive electronic components, erase or alter magnetic media, and initiate explosions or fires in flammable environments. Accumulated static charge can halt mechanical processes by clogging the flow of materials. Static-attracted contaminants can affect the purity of pharmaceuticals.
A conductive thermoplastic compound from RTP Co. (Winona, MN) is used in the main housing, battery door, and end cap of this remote heart-monitoring device manufactured by GE Marquette Medical Systems (Milwaukee, WI). The transmitter gives patients freedom of movement while electronically linking them to a remote computerized output system.
Electromagnetic and radio-frequency waves radiate from computer circuits, radio transmitters (including cellular phones), fluorescent lamps, electric motors, lightning, and many other sources. They become undesirable when they interfere with the operation of electronic devices. Consequences can include corruption of data in information storage and retrieval systems, inaccuracy in diagnostic equipment, and interruption of medical devices such as pacemakers.MATERIAL SOLUTIONS FOR STATIC PROBLEMS
Static accumulation and electrostatic discharge are controlled or eliminated by adjusting electrical characteristics of at-risk materials or their immediate environment. Conductive thermoplastic compounds prevent static accumulation from reaching dangerous levels by reducing a material's electrical resistance. This allows static to dissipate slowly and continuously rather than accumulate and discharge rapidly—perhaps as a spark.
MATERIAL SOLUTIONS FOR EMI/RFI
Shielding of electronic circuitry controls electromagnetic or radio-frequency interference, thus ensuring operational integrity and electromagnetic compliance (EMC) with existing standards. Shielding preserves operational integrity by preventing electronic noise from penetrating to susceptible circuitry, and provides EMC by preventing emissions from escaping to adjacent susceptible equipment.
Figure 1. EMI/RFI is reflected off the source side of a shield or is rereflected off a second shield surface.
Conductive thermoplastic compounds provide this shielding by absorbing electromagnetic energy and converting it to electrical or thermal energy. These compounds also function by reflecting electromagnetic energy from the source side of the shield and also by rereflecting it from the second surface of the shield (Figure 1).
STRUCTURE OF CONDUCTIVE THERMOPLASTIC COMPOUNDS
A conductive thermoplastic compound is a resin that has been modified with electrically conductive additives, including carbon-based powder and fibers, metal powder and fibers, and metal-coated fibers of carbon or glass. Varying the percentage or type of conductive additive used in the compound permits one to control the degree of electrical resistivity (Figure 2).
Figure 2. Additive concentration effect on conductivity in a typical thermoplastic (nylon 6/6).
Recently, unique conductive additives such as metal oxide–coated substrates, intrinsically conductive polymers (ICPs), and inherently dissipative polymers (IDPs) have found commercial use in conductive thermoplastic compounds. Metal oxide–coated substrates were initially introduced as colorable substitutes for carbon black powder–filled plastics. When compounded into thermoplastics, these additives are able to provide a wide range of conductive properties and colors. ICPs are polymers with strong electrical conductivity. The newest type of additive, they are expected to play significant roles in conductive applications from static protection to EMI shielding. IDPs exhibit weaker electrical properties than ICPs; when compounded with other resins, they can impart antistatic properties to molded articles. IDP-containing compounds generally have lower ionic- and metallic-contaminant levels than conductive compounds containing traditional additives and are preferred for static-protective packaging of sensitive products.
SELECTION OF CONDUCTIVE ADDITIVES
Conductive thermoplastics are generally designed to meet physical performance criteria in addition to static or EMI/RFI control. Often, these materials must perform some structural function, meet flammability or temperature standards, or provide a wear- or chemical-resistant surface. In addition, conductive compounds may need to pass purity standards prior to acceptance in medical applications because of concerns with outgassing of volatile substances and contact with ionic or metallic contaminants.
The conductive additive for any application is chosen based on performance criteria of the molded article. If conductive performance is the only specification, almost any conductive additive can be used, and cost will ultimately control the selection. When some of these other criteria are included, the selection is determined by whether the cumulative effects of various additives are acceptable for the application. The specialty compounder should have qualified and experienced engineering personnel available to aid in the additive selection process.
MECHANICS OF CONDUCTIVITY
The mechanism of conductivity in plastics is similar to that of most other materials. Electrons travel from point to point when under stress, following the path of least resistance. Most plastic materials are insulative: that is, their resistance to electron passage is extremely high (generally >1015).
Conductive modifiers with low resistance can be melt blended with plastics—in a process called extrusion compounding—to alter the polymers' inherent resistance. At a threshold concentration unique to each conductive modifier and resin combination, the resistance through the plastic mass is lowered enough to allow electron movement. Speed of electron movement depends on modifier concentration—in other words, on the separation between the modifier particles. Increasing modifier content reduces interparticle separation distance, and, at a critical distance known as the percolation point, resistance decreases dramatically and electrons move rapidly.
| Conductive | Conductive | |||||||
---|---|---|---|---|---|---|---|---|---|
Resins | |||||||||
Polypropylene (PP) | • | • | • | • | • | • | • | • | • |
Nylon 6/6 (PA) | • | • | • | • | • | • | • | • | • |
Nylon 6 (PA) | • | • | • | • | • | • | • | • | • |
Nylon 11 (PA) | • | • | • | • | • | • | • | • | • |
Nylon 6/12 (PA) | • | • | • | • | • | • | • | • | • |
Nylon 12 (PA) | • | • | • | • | • | • | • | • | • |
Nylon 6/6, impact modified (PA) | • | • | • | • | • | • | • | • | • |
Polycarbonate (PC) | • | • | • | • | • | • | • | • | • |
Polystyrene (PS) | • | • | • | • | • | • | • | • | • |
Acrylonitrile butadiene styrene (ABS) | • | • | • | • | • | • | • | • | • |
High-density polyethylene (HDPE) | • | • | • | • | • | • | • | • | • |
Low-density polyethylene (LDPE) | • | • | • | • | • | • | • | • | • |
Acetal (POM) | • | • | • | • | • | • | • | • | • |
Polysulfone (PSO) |
| • | • | • | • |
| • | • | • |
Polybutylene terephthalate (PBT) | • | • | • |