Adhesive designed for bonding silicon die

Adhesive designed for bonding silicon die. A two-component, low-stress, under-fill adhesive is suited for providing adhesion to FR-4 boards in packaging applications, as well as for bonding substrates with dissimilar coefficients of thermal expansion. Adhesive 122-24, manufactured by Creative Materials Inc. (Tyngsboro, MA; 978/649-4700), is thermally conductive and resistant to high temperatures. It is applied to substrate surfaces by screen printing, dipping, and syringe dispensing.