A pair of epoxy products offered by Rikei are designed to make the medical device designer’s task easier. First is EPO-TEK H20E, a two-component, 100% solids silver-filled epoxy system. It’s designed specifically for chip bonding in microelectronic and optoelectronic applications. Due to its high thermal conductivity, the product is also suited for thermal-management applications. EPO-TEK H20E is also available in a single component frozen syringe.
The second product, EPO-TEK 353ND, is a two component, high-temperature epoxy that’s also available in a single component frozen syringe. It offers a reasonable pot-life that allows for low-temperature curing to be realized (with an amber color change upon cure). EPO-TEK 353ND passes NASA low outgassing standard ASTM E595 with proper cure. Potential applications include potting fiber optic bundles into ferrules for light guides and endoscopes (it’s can resist several sterilization techniques including ETO, gamma, ION beam, and H202 plasma, and adhere to most surfaces); and as an adhesive for catheter devices including stents and guide wires. The epoxy is certified to USP Class VI and ISO 10993 biocompatibility standards for medical implants and is compatible with CIDEX OPA sterilization.