March 16, 2006

1 Min Read
Semiconductor Firms Partner to Build Next-Generation Medical Devices

Originally Published MPMN March 2006


INDUSTRY NEWS


Semiconductor Firms Partner to Build Next-Generation Medical Devices

Corinne Litchfield

A provider of structured application-specific integrated circuits (ASICs) has teamed up with a maker of semiconductors to develop technology for use in medical manufacturing. ASIC maker

AMI Semiconductor (AMIS; Pocatello, ID; www.amis.com) and MagnaChip Semiconductor (Seoul; www.magnachip.com), a mixed-signal semiconductor manufacturer, have formed a partnership to create technology platforms for next-generation medical devices. As a result of the partnership, both companies say they will be capable of designing and manufacturing medical devices with more functionality, expanded memory, and high reliability.

The companies will first work on a 0.18-µm process targeted at medical applications requiring ultralow power and secure memory. Initial process development will take place in Magna Chip’s manufacturing facility in Cheongju, Korea, where employees from both firms will work together to improve the process. Pilot production is expected to begin sometime in the second quarter of this year.

Next-generation medical devices, such as those used for nerve stimulation in pain management, spinal cord injuries, and epileptic seizures, often require highly technical designs that result in the need for a specialized manufacturing approach. Other medical market segments, including cardiac rhythm management and continuous glucose monitoring, will also benefit from these new platforms, the companies say.

“We believe that this relationship will benefit the entire AMIS business, providing our business units the capability to design ICs with high gate counts,” says Chris King, president and CEO of AMIS. “In addition, it offers turnkey customers the next-generation, specialized process technology required to produce robust solutions for demanding medical applications.”

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