Originally Published MPMN September 2005
Metal Strip and Wire Parts Go with the Reflow
|A proprietary reflow metallization process involves plating pure tin over
copper or brass substrates.
Lead-free plating of strip and wire is available for a variety of industrial applications. Using a proprietary reflow metallization process developed in-house, Summit Corp. of America (Thomaston, CT) offers its services for connectors, lead frames, and electronic devices. The company specializes in lead-free reel-to-reel plating and can plate any metal or combination of metals in continuous strips. Its processes meet the international standards of the EU Lead-Free Legislation.
Summit’s reflow process involves plating pure tin over copper or brass substrates. The resulting parts are metallurgically superior to conventionally plated parts, extending the shelf life and solderability of components. The process eliminates “tin whiskering,” which can cause problems. Additional benefits include improved conductivity, corrosion resistance, insertion force, and malleability.
Comparable in cost to other plating processes, reflow metallization can eliminate the need for organic brighteners or leveling agents that are harmful to the environment. The low-stress, full-bright tin coating is durable, making it capable of withstanding thermal cycling and other environmental factors.
Copyright ©2005 Medical Product Manufacturing News