A Binghamton University student examines a piece of flexible circuitry from Endicott Interconnect's CAMM facility.
Remaining competitive in a world where companies are more frequently outsourcing beyond the United States can be a challenge. Endicott Interconnect Technologies Inc. (Endicott, NY) is collaborating with two universities to develop electronics products, an industry segment that continues to move offshore.
With funding from the United States Display Consortium, Endicott Interconnect's Center for Advanced Microelectronics Manufacturing (CAMM) is working with Cornell University (Ithaca, NY) and Binghamton University (Binghamton, NY).
James McNamara (right), president and CEO of Endicott Interconnect, met with Congressman Michael Arcuri and Binghamton University president Lois DeFleur at the CAMM facility in May.
“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today's manufacturing issues,” said James McNamara, president and CEO of Endicott Interconnect. McNamara spoke at a meeting with Lois DeFleur, president of Binghamton University, and Congressman Michael Arcuri (D–NY) in May.
The partnership involves research and development related to microelectronics manufacturing in a roll-to-roll (R2R) format. The R2R process enables efficient production of components by integrating electronics on flexible plastic. It also presents opportunities for new application areas in flexible electronics.
Endicott Interconnect expects the collaboration to lead to flexible, rugged, lightweight electronic components and products for next-generation applications. Academic and industry research groups will be able to conduct manufacturing applicability testing at CAMM as well.