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Ultrasmooth Diamond Material Paves Way for New Devices

October 6, 2009

1 Min Read
Ultrasmooth Diamond Material Paves Way for New Devices

Touted by Advanced Diamond Technologies Inc. (ADT; Romeoville, IL) as "the world's smoothest vapor-deposited diamond," the company's UNCD Horizon could present new opportunities in electronic and biomedical applications, including biosensors. With a smoothness on the order of 1 nm, the diamond wafer technology is an order of magnitude smoother than the company's previous technology.To fabricate the material, the company applied a chemical-mechanical planarization (CMP) process to its already-smooth UNCD wafers. This approach, according to the company, helped to facilitate planarization of the diamond material, which can be difficult owing to the material's hardness. Not only smooth, the resulting diamond material offers a solution to a common conundrum in the semiconductor industry by enabling the direct bonding of diamond heat spreaders to transistors. It also allows for the deposition of epitaxial silicon directly on the material.Because of its ultrasmooth surface, biocompatibility, and natural mechanical properties, the material has already caught the eye of several university researchers, according to the manufacturer. For example, the company reports that a lab at Columbia University is employing UNCD Horizon in nanoimprint lithography techniques for the development of biological flow cells and semiconductors. Harvard University, on the other hand, is using the material in its creation of diamond nanophotonic technology to enable applications in biochemical sensing and nanoscale mechanics.Offered on 100-mm wafers and 1 cm2 wafer die, UNCD Horizon can be patterned using reactive ion etching and integrated into complex thin-film heterostructures.Read more about how ADT is also advancing thin-film diamond technology for biomedical applications by making an electrically conductive version, which could revolutionize in vivo MEMS device capabilities.

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