Virtual Engineering Week, an all-new virtual event connecting the global medtech, automation, design, packaging, materials, plastics and sustainability, and product development communities, took place from November 30 – December 4. Organized by Informa Markets – Engineering, the producer of MD&M, BIOMEDevice, and other events as well as the publisher of MD+DI, the online event offered daily conference sessions and a virtual expo with more than 160 virtual booths. The event drew more than 7400 registrants becoming Informa Markets – Engineering’s largest digital event to-date.

The conference dove into timely issues and trends affecting all engineers with sessions on topics ranging from digital health and miniaturization to 3D printing, smart manufacturing, medical device product development, robotics, and more. While the global pandemic continues to disrupt supply chains, attendees were given keen insights on how COVID-19 has impacted advanced manufacturing and predictions on how the industry will astutely respond.

Notably, Cynthia Star, director of technology transfer for Johnson & Johnson 3D printing team, led the session, “How Has the COVID-19 Pandemic Affected Adoption of 3D Printing in Medtech,” where Star showcased 3D printing’s role in medtech and its diverse applications in combating the virus. She noted how the technology allowed J&J to develop and put into prompt use critical cutting-edge products such as the Ventilator Expansion Splitter that allowed doctors to double the number of patients each ventilator could serve when the onset of COVID-19 made for scarce resources. Read MD+DI's coverage here: 3D Printing Helps J&J’s Ethicon Design Prisma Health’s Ventilator in 10 Days.

Industry 5.0 also was another primary focus. Another timely session was led by Shalabh Bakshi, director of digital enterprise and head of automotive vertical market at Siemens (Canada). The session, “Industry 5.0: Creative People, Collaborative Robots & Smart Factories” discussed the forces that are currently shaping advanced manufacturing and how manufacturing processes may change. Bakshi also spoke to the importance of the “circular economy,” which emphasizes cutting costs and energy consumption with a large focus on sustainability. Another key event session was “The Future of Industrial Jobs & Manufacturing” featuring session leader Ryan Chan, founder and CEO of Upkeep, speaking on the big push towards digitalization, a trend that has been pushed into full throttle amid the pandemic due to the continued need for people to connect and receive care when in-person interactions are not safe or even possible. Read MD+DI's coverage here: Manufacturing’s Digital Transformation Is Here to Stay, Says Industry Expert.

“As the producers of the nation’s largest advanced manufacturing events, we are proud to serve the industries that have been at the forefront of the fight against COVID-19 from a technology perspective,” said Steve Everly, event director, Virtual Engineering Week. “This year, more than ever, it has been imperative we stay connected and united in our efforts to innovate. Although nothing can compete with the value of face-to-face interactions, we’re thrilled Virtual Engineering Week has been able to provide these industries a source for learning and connection.”

Check out MD+DI's coverage of Virtual Engineering Week:

Can AI Help Identify Problems in Manufacturing?

Using Appropriate Controls to De-Risk Medical Devices

Overcoming the Limitations of Additive Manufacturing

AI and Machine Learning in Medical Devices: It’s Getting Better All the Time

In Pursuit of More Sustainable Packaging Solutions

Manufacturing’s Digital Transformation Is Here to Stay, Says Industry Expert

Sensors Are Helping to Put Medical Devices in the Hands of Consumers

Medical Device Design: 3 Practical Tips for Great User Interface and User Experience

Can Design Controls Accelerate Medical Innovation?

Your Chance to Drive Innovation in Medical Device Packaging

Your Biggest (and Smallest) Miniaturization Questions Answered

Be a 'Game-Changer' in Medical Device Packaging