Potting compounds and encapsulants are available with fast curing times at room temperature and minimal air entrapment. Electronics, wiring, and other components are protected from moisture, temperature extremes or cycling, and shock or vibration with the use of these materials from Devcon (Danvers, MA; 978/777-1100). Flexane compounds are known for their elasticity and flexibility after curing. The Flexane line comprises two-component liquid
urethanes with demolding times of 5–10 hours. All of these compounds are castable and nonshrinking, mix and pour easily, and cure at room temperature. Syon Tru-Cast 101/901 is part of the Syon epoxy compound family, which is made up of black and clear encapsulants, electrically and thermally conductive potting compounds, and high-density, high-temperature potting compounds. Tru-Cast 101/901 is appropriate for packaging and protection of delicate systems. It is a silica-filled, 4000-cps potting and casting resin which may be used as a UL Class B insulating compound. Syon Tru-Cast 100M/928 has good thermal shock resistance and may be cured in small masses at 250°F. This clear epoxy displays no signs of discoloration or striations when cured at room temperature in large masses. Syon Tru-Cast 111M is a high-density resin filled with aluminum oxide, offering good thermal conductivity and heat resistance.