Adhesive designed for bonding silicon die

Posted by mddiadmin on February 1, 2002

. A two-component, low-stress, under-fill adhesive is suited for providing adhesion to FR-4 boards in packaging applications, as well as for bonding substrates with dissimilar coefficients of thermal expansion. Adhesive 122-24, manufactured by Creative Materials Inc. (Tyngsboro, MA; 978/649-4700), is thermally conductive and resistant to high temperatures. It is applied to substrate surfaces by screen printing, dipping, and syringe dispensing.

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